Power chips are linked to external circuits with product packaging, and their performance depends upon the support of the product packaging. In high-power situations, power chips are normally packaged as power components. Chip affiliation refers to the electric link on the top surface of the chip, which is normally light weight aluminum bonding cord in traditional modules. ^
Typical power module package cross-section
At present, industrial silicon carbide power modules still primarily use the product packaging innovation of this wire-bonded conventional silicon IGBT module. They encounter problems such as big high-frequency parasitical specifications, not enough warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, which limit the use of silicon carbide semiconductors. The display of excellent efficiency. In order to address these issues and totally manipulate the significant prospective advantages of silicon carbide chips, many brand-new product packaging innovations and services for silicon carbide power components have actually arised in recent years.
Silicon carbide power component bonding method
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have established from gold cable bonding in 2001 to aluminum wire (tape) bonding in 2006, copper cable bonding in 2011, and Cu Clip bonding in 2016. Low-power gadgets have developed from gold wires to copper wires, and the driving pressure is price reduction; high-power devices have actually developed from aluminum cords (strips) to Cu Clips, and the driving pressure is to enhance product performance. The greater the power, the greater the demands.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a packaging process that utilizes a solid copper bridge soldered to solder to attach chips and pins. Compared with typical bonding product packaging techniques, Cu Clip modern technology has the following benefits:
1. The link between the chip and the pins is made from copper sheets, which, to a particular degree, replaces the common cable bonding method in between the chip and the pins. Therefore, a special package resistance worth, greater existing flow, and much better thermal conductivity can be obtained.
2. The lead pin welding area does not require to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The item look is totally consistent with normal items and is mostly made use of in web servers, mobile computers, batteries/drives, graphics cards, electric motors, power products, and various other fields.
Cu Clip has two bonding techniques.
All copper sheet bonding method
Both the Gate pad and the Resource pad are clip-based. This bonding technique is more expensive and intricate, but it can accomplish better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cable bonding technique
The resource pad utilizes a Clip approach, and the Gate utilizes a Wire approach. This bonding approach is somewhat less costly than the all-copper bonding approach, conserving wafer area (appropriate to very little entrance locations). The process is less complex than the all-copper bonding technique and can get much better Rdson and far better thermal impact.
Provider of Copper Strip
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